Wafer Demounting Equipment
Wafer Demounting Equipment
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Processing Equipment

We can provide all kinds of processing equipment which can process wafers with various quality. Proposals of any processing procedure for these equipment can also be delivered.

 

Wafer Edge Grinding Equipment

Wafer Demounting Equipment

Wafer Grinding Equipment

Wafer Lapping Equipment

Wafer CMP Equipment

Mass-produced Grinding Equipment

R&D Wafer Dicing Equipment

R&D Wafer Processing Equipment

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会社名:株式会社ライズセミコン
設立: 2021年12月06日
本社所在地: 〒111-0024
東京都台東区今戸2丁目20番4号 1F

Contact Us

#1F 2-20-4 Imado, Taito-ku,
Tokyo-to 111-0024 Japan

+81-03-6802-4378

a-uchi@risemi.jp(JAPAN)kiera.hou@riseway-group.com (CHINA)chrysh.hou@riseway-group.com(OVERSEA)